Direct plating on polyimide film
Achieve direct electroless plating with high adhesion, reduced lead time, and cost reduction!
We have achieved direct electroless plating without the need for a base film such as vapor deposition or sputtering on film substrates, resulting in high adhesion, reduced lead times, and cost savings. Additionally, we can form patterns through etching after plating upon request. Hōwa Sangyō is prepared to assist in research and development for industries with such applications, accommodating even single prototype requests, so please consult us for prototype development. For more details, please contact us or refer to our catalog.
- 企業：豊和産業
- 価格：Other
